This article explores the core SMT assembly technologies for data-center optical-module PCBs in the CPO era, highlighting key challenges and practical solutions in electro-optical co-design, thermal-power management, and precision manufacturing. As an OEM (Original Equipment Manufacturer) supplier, ZEISS Semiconductor Manufacturing Technology (SMT) enables the semiconductor industry worldwide with optics and other optical modules. For this, we constantly push the. With over 20 years of experience, LUMISTRIPS provides advanced design, prototyping, and high-volume production using cutting-edge equipment in our ISO-certified, eco-powered facility in Germany. Our flexible manufacturing process includes SMT assembly, precise soldering, traceability, optical. As data centers advance toward 800G and even 1. 6T speeds, the power consumption and thermal density of pluggable optical modules such as QSFP-DD and OSFP have reached unprecedented levels. Integrating high-speed DSP chips, laser drivers, TIAs, and passive components into a high-performance PCB. The PCB baseboard that carries the electro-optical conversion core sits at the center, and its SMT assembly process combines cross-disciplinary problems in high-speed circuits, precision optics, and complex thermal management.